Specifications

*It cannot be used as silicone grease on the CPU. It is a high thermal performance, unique, fully cured thermal management solution for electronic assemblies, this material is not dry out. *It has low viscosity for dispensing use application; this material have good tacky on the heat-sink can be used for application involving auto-dispensing equipment or stencil screen-printing. *Its ideal for rework and field repair situations. Compare with thermal pad this material is can fully fill the gap and good compression, cost saving. *It is ROHS compliant and halogen-free, offering extra reassurance in applications where hazardous substances are forbidden.

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